Encapsulation Technologies for Electronic Applications - Materials and Processes for Electronic Applications - Ardebili, Haleh (Department of Mechanical Engineering, University of Houston, USA and visiting scholar, Mechanical Engineering and Materials Science Department, Rice University) - Bøker - William Andrew Publishing - 9780128119785 - 11. oktober 2018
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Encapsulation Technologies for Electronic Applications - Materials and Processes for Electronic Applications 2. utgave

Ardebili, Haleh (Department of Mechanical Engineering, University of Houston, USA and visiting scholar, Mechanical Engineering and Materials Science Department, Rice University)

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Encapsulation Technologies for Electronic Applications - Materials and Processes for Electronic Applications 2. utgave

498 pages

Media Bøker     Pocketbok   (Bok med mykt omslag og limt rygg)
Utgitt 11. oktober 2018
ISBN13 9780128119785
Utgivere William Andrew Publishing
Antall sider 508
Mål 151 × 229 × 24 mm   ·   675 g
Serieredaktør Licari, James J. (AvanTeco, Whittier, CA, USA)

Se alt med Ardebili, Haleh (Department of Mechanical Engineering, University of Houston, USA and visiting scholar, Mechanical Engineering and Materials Science Department, Rice University) ( f.eks. Pocketbok og Innbunden bok )