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Through Silicon Vias: Materials, Models, Design, and Performance 1. utgave
Brajesh Kumar Kaushik
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Through Silicon Vias: Materials, Models, Design, and Performance 1. utgave
Brajesh Kumar Kaushik
Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most recent advancements in materials, models and designs. Furthermore, depending on the geometry and ph
216 pages
| Media | Bøker Pocketbok (Bok med mykt omslag og limt rygg) |
| Utgitt | 30. juni 2020 |
| ISBN13 | 9780367574543 |
| Utgivere | Taylor & Francis Ltd |
| Antall sider | 216 |
| Mål | 453 g |
| Språk | Engelsk |
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