Thermal Management of Microelectronic Equipment: Heat Transfer Theory, Analysis Methods, and Design Practices - Electronic Packaging - Lian-Tuu Yeh - Bøker - American Society of Mechanical Engineers - 9780791861097 - 1. juni 2016
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Thermal Management of Microelectronic Equipment: Heat Transfer Theory, Analysis Methods, and Design Practices - Electronic Packaging 2 Revised edition

Lian-Tuu Yeh

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Thermal Management of Microelectronic Equipment: Heat Transfer Theory, Analysis Methods, and Design Practices - Electronic Packaging 2 Revised edition

This second edition of a classic text is fully updated and greatly expanded, with in-depth revisions that include advances in the component technology of microelectronics. This book emphasizes the solving of practical design problems in a wide range of subjects related to various heat transfer technologies.

500 pages, black & white illustrations

Media Bøker     Innbunden bok   (Bok med hard rygg og stivt omslag)
Utgitt 1. juni 2016
ISBN13 9780791861097
Utgivere American Society of Mechanical Engineers
Antall sider 500
Mål 152 × 229 × 29 mm   ·   866 g
Språk Engelsk  
Serieredaktør Agonafer, D.
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