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Electromigration in Metals: Fundamentals to Nano-Interconnects
Ho, Paul S. (University of Texas, Austin)
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Electromigration in Metals: Fundamentals to Nano-Interconnects
Ho, Paul S. (University of Texas, Austin)
Learn to assess electromigration reliability, and design more resilient chips, from this comprehensive resource. Building from fundamental physics to advanced methodologies, this book enables the reader to develop highly reliable on-chip wiring stacks and power grids. This is an ideal text for materials scientists and chip design engineers.
400 pages
| Media | Bøker Innbunden bok (Bok med hard rygg og stivt omslag) |
| Utgitt | 12. mai 2022 |
| ISBN13 | 9781107032385 |
| Utgivere | Cambridge University Press |
| Antall sider | 430 |
| Mål | 251 × 176 × 27 mm · 978 g |