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Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys - the Springer International Series in Engineering and Computer Science 2003 edition
Erdogan Madenci
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Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys - the Springer International Series in Engineering and Computer Science 2003 edition
Erdogan Madenci
Discusses specific steps of the analysis method through examples without leaving any room for confusion. This title allows the engineers to conduct fatigue reliability analysis of solder joints in electronic packages.
205 pages, biography
| Media | Bøker Innbunden bok (Bok med hard rygg og stivt omslag) |
| Utgitt | 31. desember 2002 |
| ISBN13 | 9781402073304 |
| Utgivere | Kluwer Academic Publishers |
| Antall sider | 205 |
| Mål | 156 × 234 × 12 mm · 489 g |
| Språk | Engelsk |