Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys - the Springer International Series in Engineering and Computer Science - Erdogan Madenci - Bøker - Kluwer Academic Publishers - 9781402073304 - 31. desember 2002
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Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys - the Springer International Series in Engineering and Computer Science 2003 edition

Erdogan Madenci

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Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys - the Springer International Series in Engineering and Computer Science 2003 edition

Discusses specific steps of the analysis method through examples without leaving any room for confusion. This title allows the engineers to conduct fatigue reliability analysis of solder joints in electronic packages.


205 pages, biography

Media Bøker     Innbunden bok   (Bok med hard rygg og stivt omslag)
Utgitt 31. desember 2002
ISBN13 9781402073304
Utgivere Kluwer Academic Publishers
Antall sider 205
Mål 156 × 234 × 12 mm   ·   489 g
Språk Engelsk  

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