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Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications - Electronic Packaging and Interconnects Softcover reprint of the original 1st ed. 1999 edition
Dean L. Monthei
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Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications - Electronic Packaging and Interconnects Softcover reprint of the original 1st ed. 1999 edition
Dean L. Monthei
Packaging engineers now have to work with die level designers to either create a package that performs well at high frequencies or to use readily available low cost packages that happen to meet the needs of the application.
248 pages, 62 black & white illustrations, biography
| Media | Bøker Pocketbok (Bok med mykt omslag og limt rygg) |
| Utgitt | 14. mars 2014 |
| ISBN13 | 9781461373254 |
| Utgivere | Springer-Verlag New York Inc. |
| Antall sider | 234 |
| Mål | 155 × 235 × 13 mm · 358 g |
| Språk | Engelsk |
Se alt med Dean L. Monthei ( f.eks. Innbunden bok og Pocketbok )