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Silver Metallization: Stability and Reliability - Engineering Materials and Processes 2008 edition
Daniel Adams
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Silver Metallization: Stability and Reliability - Engineering Materials and Processes 2008 edition
Daniel Adams
Here is the first book to discuss the current understanding of silver metallization and its potential as a future interconnect material for integrated circuit technology. With the lowest resistivity of all metals, silver is an attractive interconnect material for higher current densities and faster switching speeds in integrated circuits.
123 pages, black & white illustrations
| Media | Bøker Pocketbok (Bok med mykt omslag og limt rygg) |
| Utgitt | 14. mars 2012 |
| Opprinelig utgitt | 2011 |
| ISBN13 | 9781849967051 |
| Utgivere | Springer London Ltd |
| Antall sider | 123 |
| Mål | 155 × 235 × 7 mm · 199 g |
| Språk | Engelsk |
