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Three-Dimensional Integration and Modeling: A Revolution in RF and Wireless Packaging - Synthesis Lectures on Computational Electromagnetics
Jong-Hoon Lee
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Three-Dimensional Integration and Modeling: A Revolution in RF and Wireless Packaging - Synthesis Lectures on Computational Electromagnetics
Jong-Hoon Lee
Table of Contents: Introduction / Background on Technologies for Millimeter-Wave Passive Front-Ends / Three-Dimensional Packaging in Multilayer Organic Substrates / Microstrip-Type Integrated Passives / Cavity-Type Integrated Passives / Three-Dimensional Antenna Architectures / Fully Integrated Three-Dimensional Passive Front-Ends / References
108 pages, X, 108 p.
Media | Bøker Pocketbok (Bok med mykt omslag og limt rygg) |
Utgitt | 31. desember 2007 |
ISBN13 | 9783031005756 |
Utgivere | Springer International Publishing AG |
Antall sider | 108 |
Mål | 241 g |
Språk | Engelsk |