This large international conference covered advances in engineering technologies and the physical sciences, with contributions on subjects including mechanical engineering, bioengineering, internet engineering, image engineering, wireless networks, knowledge engineering, manufacturing engineering, and industrial applications.

546 pages, 10 Tables, color; 250 Illustrations, black and white; X, 546 p. 250 illus.

Media	Bøker Pocketbok (Bok med mykt omslag og limt rygg)
Utgitt	7. juni 2018
ISBN13	9789811093265
Utgivere	Springer Verlag, Singapore
Antall sider	546
Mål	150 × 220 × 10 mm · 771 g
Redaktør	Ao, Sio-Iong
Redaktør	Gelman, Len
Redaktør	Yang, Gi-Chul