Fortell venner om denne varen:
Solder Joint Reliability: Theory and Applications 1991 edition
John H. Lau
Pris
NOK 2.369
Bestillingsvarer
Forventes levert 14. - 25. nov
Julegaver kan byttes frem til 31. januar
Legg til iMusic ønskeliste
eller
Finnes også som:
Solder Joint Reliability: Theory and Applications 1991 edition
John H. Lau
New electronic packaging centers stimulate applications, and materials engineering and science departments have demonstrated a new vigor to improve both the materials and our understanding of them.
631 pages, 146 black & white illustrations, biography
| Media | Bøker Innbunden bok (Bok med hard rygg og stivt omslag) |
| Utgitt | 31. mai 1991 |
| ISBN13 | 9780442002602 |
| Utgivere | Van Nostrand Reinhold Inc.,U.S. |
| Antall sider | 631 |
| Mål | 155 × 235 × 34 mm · 975 g |
| Språk | Engelsk |
![Cover for John H. Lau · Chiplet Design and Heterogeneous Integration Packaging (Pocketbok) [2023 edition] (2024)](https://imusic.b-cdn.net/images/item/original/192/9789811999192.jpg?john-h-lau-2024-chiplet-design-and-heterogeneous-integration-packaging-pocketbok&class=scaled&v=1722057566)
![Cover for John H. Lau · Chiplet Design and Heterogeneous Integration Packaging (Innbunden bok) [2023 edition] (2023)](https://imusic.b-cdn.net/images/item/original/161/9789811999161.jpg?john-h-lau-2023-chiplet-design-and-heterogeneous-integration-packaging-innbunden-bok&class=scaled&v=1695532633)
![Cover for John H. Lau · Semiconductor Advanced Packaging (Pocketbok) [2021 edition] (2022)](https://imusic.b-cdn.net/images/item/original/784/9789811613784.jpg?john-h-lau-2022-semiconductor-advanced-packaging-pocketbok&class=scaled&v=1653589884)
![Cover for John H. Lau · Assembly and Reliability of Lead-Free Solder Joints (Pocketbok) [2020 edition] (2021)](https://imusic.b-cdn.net/images/item/original/220/9789811539220.jpg?john-h-lau-2021-assembly-and-reliability-of-lead-free-solder-joints-pocketbok&class=scaled&v=1622167029)
![Cover for John H. Lau · Semiconductor Advanced Packaging (Innbunden bok) [2021 edition] (2021)](https://imusic.b-cdn.net/images/item/original/753/9789811613753.jpg?john-h-lau-2021-semiconductor-advanced-packaging-innbunden-bok&class=scaled&v=1623687781)
![Cover for John H. Lau · Assembly and Reliability of Lead-Free Solder Joints (Innbunden bok) [2020 edition] (2020)](https://imusic.b-cdn.net/images/item/original/190/9789811539190.jpg?john-h-lau-2020-assembly-and-reliability-of-lead-free-solder-joints-innbunden-bok&class=scaled&v=1588376991)
![Cover for John H. Lau · Heterogeneous Integrations (Innbunden bok) [2019 edition] (2019)](https://imusic.b-cdn.net/images/item/original/230/9789811372230.jpg?john-h-lau-2019-heterogeneous-integrations-innbunden-bok&class=scaled&v=1588376885)
![Cover for John H. Lau · Fan-Out Wafer-Level Packaging (Pocketbok) [Softcover Reprint of the Original 1st 2018 edition] (2018)](https://imusic.b-cdn.net/images/item/original/660/9789811342660.jpg?john-h-lau-2018-fan-out-wafer-level-packaging-pocketbok&class=scaled&v=1588376983)
![Cover for John H. Lau · Fan-Out Wafer-Level Packaging (Innbunden bok) [2018 edition] (2018)](https://imusic.b-cdn.net/images/item/original/834/9789811088834.jpg?john-h-lau-2018-fan-out-wafer-level-packaging-innbunden-bok&class=scaled&v=1588376972)
![Cover for John H. Lau · Handbook Of Tape Automated Bonding (Innbunden bok) [1992 edition] (1992)](https://imusic.b-cdn.net/images/item/original/279/9780442004279.jpg?john-h-lau-1992-handbook-of-tape-automated-bonding-innbunden-bok&class=scaled&v=1570666783)