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Advances in CMP Polishing Technologies Toshiro Doi
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Advances in CMP Polishing Technologies
Toshiro Doi
CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. This title presents the developments and technological innovations in the field - making R&D accessible to the wider engineering community.
330 pages, 1, black & white illustrations
| Media | Bøker Innbunden bok (Bok med hard rygg og stivt omslag) |
| Utgitt | 6. desember 2011 |
| ISBN13 | 9781437778595 |
| Utgivere | William Andrew Publishing |
| Antall sider | 328 |
| Mål | 160 × 239 × 23 mm · 544 g |
| Språk | Engelsk |
| Redaktør | Doi, Toshiro (Professor of Manufacturing Processes, Department of Mechanical Engineering, Kyushu University, Japan) |
| Redaktør | Kurokawa, Syuhei |
| Redaktør | Marinescu, Ioan D. (Professor and Director, Precision Micromachining Center, The University of Toledo, Toledo, OH, USA) |
