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Solder Joint Reliability: Theory and Applications Softcover reprint of the original 1st ed. 1991 edition
John H. Lau
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Solder Joint Reliability: Theory and Applications Softcover reprint of the original 1st ed. 1991 edition
John H. Lau
New electronic packaging centers stimulate applications, and materials engineering and science departments have demonstrated a new vigor to improve both the materials and our understanding of them.
652 pages, 146 black & white illustrations, biography
| Media | Bøker Pocketbok (Bok med mykt omslag og limt rygg) |
| Utgitt | 23. februar 2014 |
| ISBN13 | 9781461367437 |
| Utgivere | Springer-Verlag New York Inc. |
| Antall sider | 631 |
| Mål | 155 × 235 × 34 mm · 902 g |
| Språk | Engelsk |
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