Dean L. Monthei
Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications - Electronic Packaging and Interconnects Dean L. Monthei Softcover reprint of the original 1st ed. 1999 edition

Name: Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications - Electronic Packaging and Interconnects
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Author: Dean L. Monthei

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1999 edition

(1998) NOK 999

Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications - Electronic Packaging and Interconnects

Dean L. Monthei

Softcover reprint of the original 1st ed. 1999 edition

Packaging engineers now have to work with die level designers to either create a package that performs well at high frequencies or to use readily available low cost packages that happen to meet the needs of the application.

248 pages, 62 black & white illustrations, biography

Media	Bøker Pocketbok (Bok med mykt omslag og limt rygg)
Utgitt	14. mars 2014
ISBN13	9781461373254
Utgivere	Springer-Verlag New York Inc.
Antall sider	234
Mål	155 × 235 × 13 mm · 358 g
Språk	Engelsk