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Materials for Advanced Packaging 2nd ed. 2017 edition
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Materials for Advanced Packaging
Original chapters on bonding and joining techniques, nanopackaging and biomedical packaging, MEMS and wafer level chip scale packaging, and packaging materials such as lead-free solders, flip chip underfills, epoxy molding compounds, and conductive adhesives have all been updated with the latest developments in the field.
983 pages, 260 black & white illustrations, 440 colour illustrations, 85 black & white tables, 434 c
| Media | Bøker Innbunden bok (Bok med hard rygg og stivt omslag) |
| Utgitt | 30. desember 2016 |
| ISBN13 | 9783319450971 |
| Utgivere | Springer International Publishing AG |
| Antall sider | 969 |
| Mål | 155 × 235 × 51 mm · 1,55 kg |
| Språk | Fransk |
| Redaktør | Lu, Daniel |
| Redaktør | Wong, C.P. |
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