Ran Wang
Testing of Interposer-Based 2.5D Integrated Circuits Ran Wang Softcover reprint of the original 1st ed. 2017 edition

Name: Testing of Interposer-Based 2.5D Integrated Circuits
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Author: Ran Wang

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1st ed. 2017 edition

(2017) NOK 999

Testing of Interposer-Based 2.5D Integrated Circuits

Ran Wang

Softcover reprint of the original 1st ed. 2017 edition

The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies.

182 pages, 50 Tables, color; 102 Illustrations, color; 16 Illustrations, black and white; XIV, 182 p

Media	Bøker Pocketbok (Bok med mykt omslag og limt rygg)
Utgitt	9. mai 2018
ISBN13	9783319854618
Utgivere	Springer International Publishing AG
Antall sider	182
Mål	150 × 220 × 10 mm · 285 g
Språk	Tysk