Jan A. Dziuban
Bonding in Microsystem Technology - Springer Series in Advanced Microelectronics Jan A. Dziuban Softcover reprint of hardcover 1st ed. 2006 edition

Name: Bonding in Microsystem Technology - Springer Series in Advanced Microelectronics
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Author: Jan A. Dziuban

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Bonding in Microsystem Technology - Springer Series in Advanced Microelectronics

Jan A. Dziuban

Softcover reprint of hardcover 1st ed. 2006 edition

This is the first compendium on silicon/glass microsystems made by deep wet etching and the first book with a detailed description of bonding techniques used in microsystem technology. Technological results presented in the book have been tested experimentally by the author and his team, and can be utilized in day-to-day laboratory practice.

334 pages, biography

Media	Bøker Pocketbok (Bok med mykt omslag og limt rygg)
Utgitt	25. november 2010
ISBN13	9789048171514
Utgivere	Springer
Antall sider	334
Mål	155 × 235 × 18 mm · 494 g
Språk	Engelsk