3D Microelectronic Packaging: From Architectures to Applications - Springer Series in Advanced Microelectronics Second Edition 2021 edition

Name: 3D Microelectronic Packaging: From Architectures to Applications - Springer Series in Advanced Microelectronics
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Second Edition 2021 edition

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3D Microelectronic Packaging: From Architectures to Applications - Springer Series in Advanced Microelectronics

Second Edition 2021 edition

This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging.

622 pages, 100 Tables, color; 205 Illustrations, color; 94 Illustrations, black and white; XVII, 622

Media	Bøker Pocketbok (Bok med mykt omslag og limt rygg)
Utgitt	24. november 2021
ISBN13	9789811570926
Utgivere	Springer Verlag, Singapore
Antall sider	622
Mål	150 × 220 × 10 mm · 967 g
Redaktør	Goyal, Deepak
Redaktør	Li, Yan