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Chiplet Design and Heterogeneous Integration Packaging 2023 edition
John H. Lau
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Chiplet Design and Heterogeneous Integration Packaging 2023 edition
John H. Lau
525 pages, 501 Illustrations, color; 42 Illustrations, black and white; XXII, 525 p. 543 illus., 501
| Media | Bøker Innbunden bok (Bok med hard rygg og stivt omslag) |
| Utgitt | 28. mars 2023 |
| ISBN13 | 9789811999161 |
| Utgivere | Springer Verlag, Singapore |
| Antall sider | 525 |
| Mål | 242 × 162 × 33 mm · 1,07 kg |
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