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![Cover for John Lau · Thermal Stress and Strain in Microelectronics Packaging (Pocketbok) [Softcover reprint of the original 1st ed. 1993 edition] (2012)](https://imusic.b-cdn.net/images/item/original/696/9781468477696.jpg?john-lau-2012-thermal-stress-and-strain-in-microelectronics-packaging-pocketbok&class=scaled&v=1539207051)