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3D Stacked Chips: From Emerging Processes to Heterogeneous Systems Softcover reprint of the original 1st ed. 2016 edition
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3D Stacked Chips: From Emerging Processes to Heterogeneous Systems
This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl.
339 pages, 193 Tables, color; 22 Tables, black and white; 157 Illustrations, color; 81 Illustrations
| Media | Bøker Pocketbok (Bok med mykt omslag og limt rygg) |
| Utgitt | 26. mai 2018 |
| ISBN13 | 9783319793054 |
| Utgivere | Springer International Publishing AG |
| Antall sider | 339 |
| Mål | 150 × 220 × 10 mm · 508 g |
| Språk | Tysk |
| Redaktør | Elfadel, Ibrahim (Abe) M. |
| Redaktør | Fettweis, Gerhard |